Menu

Probe Cards - 日本電子材料株式会社

Contact

JP/EN

Probe Cards

Probe Card

Advanced
Probe Card/M type

  • MC Series
    MCシリーズ

    MEMS probe card created with MEMS (Micro Electro Mechanical Systems) and thin film multilayer wiring technology. Supports full wafer probing for 300mm wafers.
    MC Series is a probe card technology suitable for DRAM and NAND flash memory devices.

  • MT Series
    MTシリーズ

    MEMS probe card created with MEMS (Micro Electro Mechanical Systems) and thin film multilayer wiring technology. Supports fine-pitch area arrays by use of vertical MEMS probe. MT Series is a probe technology developed for flip chips with Cu pillar bumps and pads.

Advanced
Probe Card/V type

  • VS Series
    VSシリーズ

    Vertical probe card with micro spring pins can support various attachment methods such as wire transformer, MLO, MLC and direct attachment.
    VS Series is a probe card technology recommended for flip chip, area array, and wafer-level CSP.

  • VC Series
    VCシリーズ

    Vertical probe card with buckling structure. Supports 12-inch size wafer batch contact.
    VC Series is a probe card technology designed for high-parallelism testing of memory and logic devices

  • VT Series
    VTシリーズ

    Cantilever probe cards structurally restrict multi-DUT testing for devices with peripheral pads. VT Series uses a vertical structure, which solves DUT restrictions and improves electrical properties.
    VT Series is a probe card technology designed for multi-DUT testing of logic devices with fine-pitch peripheral pads.

  • VE Series
    VEシリーズ

    A hybrid probe card structure combining vertical and cantilever probe card features.
    VE Series is a probe card technology developed for high-parallelism testing of CMOS imaging sensors with openings for light source.

Cantilever
Probe Card/C type

  • CE Series
    CEシリーズ

    Cantilever probe card with cantilever probe wires attached to epoxy ring.
    CE Series is a probe card technology suitable for testing various types of logic IC such as high current automobile devices and application processors from transistor devices.

Copyright © JAPAN ELECTRONIC MATERIALS CORPORATION All Rights Reserved.