Semiconductors are incorporated into a variety of electrical products.　As these products are highly functioned, the amount of mounted semiconductors is increasing dramatically.　Because of this, the needs for probe cards are growing, which are applicable for semiconductors with larger densities and higher speed, and wafers with wider bores (300 millimeters).　The increase of demand for probe cards is expected in the area of final test in the semiconductor manufacturing process as packages shift to smaller size to be applicable for narrower semiconductor pitch length.

In addition, semiconductor makers are pursuing to integrate test processes, cutting final test to the utmost and increasing probe tests at wafer level in order to reduce the test cost.

More than ever, these various factors are boosting the needs and expectations of JEM's probe cards.